January 21, 2021

Ansys SignalSimulation400x275Pittsburgh-based Ansys, which develops engineering simulation software, has announced the launch of Ansys HFSS Mesh Fusion, designed to drive the rapid and fully coupled simulation of complex electromagnetic (EM) systems without compromising the design or fidelity. Applications of the new software include industrial Internet of Things, AI, machine learning, autonomous vehicles and 5G communications, the company said.

“Modern electronic products are more sophisticated than ever, with higher density, lower voltage margins and more advanced processes,” the company said in a statement. “To deliver innovation, engineers must increase functionality and maintain or even decrease power consumption within a smaller form factor. As these designs become more challenging, engineers must solve complex interactions between components and across systems.”

The HFSS Mesh Fusion software, available in Ansys HFSS 2021 R1, helps engineers combine integrated circuits (IC), packaging, connectors, printed circuit boards, antennas and platforms in a single Ansys HFSS analysis to predict EM interactions. It bypasses previous barriers by applying optimal meshing technology at the component level, parallelized across cores, clusters or within the Ansys Cloud, the company said. Solver technology then extracts a fully coupled, uncompromised, full-wave EM Matrix, letting designers push the limits of performance to create new innovations.

“Increasing levels of electronic system integration are leading to a greater demand for comprehensive EM system analysis,” said Sangyun Kim, vice president of the Foundry Design Technology Team at Samsung Electronics. “Ansys HFSS Mesh Fusion makes it possible for our talented engineering teams to create optimal designs, shrink design cycles and cost, and increase the value that we deliver to our customers.”

The software will allow IC designers to manage the capacity, complexity, dimensional range and density of geometric details in a fully coupled EM simulation, the company said. “This empowers engineers to break the old rules, innovate leading-edge designs at higher frequencies and within tighter form factors, tape out with confidence and deliver trailblazing products with more functionality than ever thought possible,” said John Lee, vice president and general manager at Ansys. “This supports numerous highly sophisticated applications, including 5G communications, autonomous driving and many more.”

More details are available at the Ansys websitehttps://www.ansys.com/.