Microprocessors

Cincoze 400x275Taiwan’s Cincoze has announced that its Cincoze DS-1300 rugged industrial computer series has become the choice of epidemic prevention equipment vendors. The DS-1300 can be used within intelligent thermal gate warning systems and intelligent autonomous mobile robots (AMRs) that provide disinfection tasks.

 

Toshiba TXZ 400x275Toshiba Electronic Devices & Storage Corp. has announced the start of mass production of 12 new devices in the M4K Group for motor control, the first products in the TXZ+ family advanced class. The company said it will start mass production of another 10 products in the M4M group in August 2021. Both groups of microcontrollers will be manufactured in a 40nm process, and belong to the TXZ4A+ series, Toshiba said.

 

Vecow Hailo 8 400x275Vecow Co., which develops embedded technologies, has announced a partnership with artificial intelligence chipmaker Hailo, to launch a next-generation AI solution, the ABP-3000 AI computing system. The system features a compact Hailo-8 AI accelerator module, enabling better performance and AI inference capabilities at the edge. The collaboration allows for best-in-class power productivity and edge ecosystem development possibilities, the companies said in a statement.

 

Blaize AI Edge400x275Blaize, which develops artificial intelligence computing and automotive computing solutions, and eYs3D Microelectronics, an image processing solution provider developing 3D vision for edge AI, have announced a reference design for the Blaize Pathfinder P1600 SoM (system on a module).

 

AmbarellaCV5S 400x275Ambarella, which develops AI vision technologies, has announced the expansion of its AI vision system-on-chip (SoC) portfolio with the new CV5S and CV52S security families. Based on the company’s CVflow architecture and 5nm process technology, the new SoCs support simultaneous 4K encoding and advanced AI processing in a single low-power design, and is aimed at security camera applications that require multiple sensors for 360-degree coverage over a wide area and with long range, such as outdoor city environments or large buildings.

 

THP7312 WLSCP 400x275THine Solutions, which develops high-speed serial interfaces and image signal processors (ISPs), has launched a new ISP (the THP7312-P) to support video streaming resolutions up to 4K at 30 frames per second in the YUV format. The ISP is available in two package options – BGA (8.0 by 8.0 mm) and a smaller WLCSP (3.9 by 4.0 mm).

 

Mythic M1076 400x275Mythic, which develops analog AI processors with compute-in-memory technology, has launched the new M1076 Analog Matrix Processor (Mythic AMP) to address performance, scalability and power efficiency for edge AI applications. The M1076 AMP comes in several form factors: a stand-alone processor; an ultra-compact PCIe M.2 card; and a PCIe card with up to 16 AMPs. The new products will be available for evaluation beginning in July 2021.

 

InteractMicroChips400x275Market intelligence company Interact Analysis is predicting a slower-than-previously-expected global recovery from the pandemic, due to problems in the semiconductor sector and the looming “black cloud” of inflation. The predictions are part of the company’s latest quarterly update of its Manufacturing Industry Output (MIO) Tracker, which includes data from three new key regions – Malaysia, Indonesia, and Vietnam.

 

SiLC Funding400x275SiLC Technologies, which develops machine vision systems, has announced a $17 million Series A funding round, led by Alter Venture Partners and Dell Technologies Capital, with participation from other investors. Following a $12 million seed round in 2020, the new financing brings the total funding to more than $30 million. The company said the new financing will be used to expand SiLC’s operations, accelerate product development, and gain additional production design wins, all in preparation for pre-production and product launch activities.

 

RZ2VL Renesas400x275Renesas Electronics Corporation, which supplies advanced semiconductor solutions, has announced expanding its RZ/V Series of microprocessors (MPUs) with the new RZ/V2L, designed for entry-level AI-enabled applications. As part of the series, the new MPUs include an exclusive AI accelerator, the DRP-AI (Dynamically Reconfigurable Processor) to make embedded AI easier and more power-efficient. Sample shipments are now available, and mass production is scheduled for December 2021.

 

IBM 2nm chip 400x275IBM has unveiled a breakthrough in semiconductor design and process with the development of the world's first chip with 2 nanometer (nm) nanosheet technology. Semiconductors play critical roles in everything from computing, to appliances, to communication devices, transportation systems, and critical infrastructure.

 

NeousysPOC 400 400x275CoastIPC, a supplier of industrial and embedded computers and peripherals, has announced it is offering the new POC-400 compact embedded computer from Neousys Technology. Measuring only 56 by 108 by 153 mm, the new PC includes an Intel Elkhart Lake Atom processor and targets factory automation and edge artificial intelligence applications.

 

UhnderPort400x275Austin, Texas-based Uhnder, which is developing digital imaging radar technologies for automotive and logistics applications, has teamed up with Yunshan Technologies to deliver a digital perception radar sensor solution for use in autonomous trucks operating in shipping ports. China Merchants Port (CMPort) is an early adopter and deploying digital perception radar in a fleet of autonomous trucks at its Mawan Smart Port in Shenzhen, China.

KriaK26SOM 400x275Xilinx, which develops processing platforms for cloud, edge and endpoint applications, has announced the Kria portfolio of adaptive system-on-modules (SOMs), production-ready small form factor embedded boards that enable rapid deployment in edge-based applications. With a complete software stack and pre-built, production-grade accelerated applications, Kria SOMs can help bring adaptive computing to AI and software developers, the company said.

ZF ProAI 400x275At the Auto Shanghai 2021 event, ZF unveiled the next generation of its ZF ProAI, a flexible and scalable supercomputer aimed at applications from automated driving levels 2 through 5. The company said ZF ProAI will go into serial production by late 2024.

SamsungPixCell400x275Samsung Electronics has announced PixCell LED, a new automotive LED module optimized for intelligent headlights, including adaptive driving beam (ADB) systems. While aimed at automobiles with human drivers, the company said this will also be aimed at electric and autonomous vehicles. Headlights powered by the LEDs can help improve driver visibility and safety to enhance the driving experience at night and in poor weather conditions such as fog or heavy rain.