SalienceLabsPhotonicChip400x275England-based Salience Labs has announced it raised $11.5 million in a seed round to develop an ultra high-speed multi-chip processor that combines photonics and electronics to accelerate exponential advances in artificial intelligence.


AIE900 XNX 400x275Axiomtek, which develops and manufactures industrial computer products, has announced the AIE900-XNX, its new edge computing system that uses the NVIDIA Jetson Xavier NX platform. The new system is aimed at vision AI applications including computer vision, vision-guided robotics, autonomous mobile robots, intelligent roadside units, workplace safety, obstacle detection and traffic management, among others.


ThundercommSoC400x275China’s Pudu Robotics has announced unveiling two intelligent robots empowered by Thundercomm’s advanced system on module (SOM) products and technologies. The SwiftBot and PUPU D1 are designed to meet the demands of food delivery and restaurants and goods deliveries in separate scenarios.


Lanner MOV 400x275Lanner Electronics and MOV.AI have announced a collaboration to provide developers of autonomous mobile robots (AMRs) an integrated computing and software platform to help optimize performance and speed the deployment of AMRs.


NVIDIA Jetson agx orin400x275NVIDIA has announced the availability of its Jetson AGX Orin developer kit, a compact and energy-efficient AI supercomputer for advanced robotics, autonomous machines and the next generation of embedded and edge computing systems.



OusterDigitalLidar400x275Ouster has announced the introduction of the Chronos chip, an automotive-grade, custom digital lidar silicon receiver that will power its DF solid-state sensor suite. The Chronos chip is the foundation of the DF architecture, and allows Ouster to deliver more power efficient, higher performance and compact digital lidar sensors to enable Level 2 through Level 5 automation in high-volume automotive production vehicles.


CincozeDI 1100 400x275Cincoze has announced a new industrial embedded computer aimed at different smart factory applications. The DI-1100 is designed for autonomous mobile robots (AMRs), ensuring on-time delivery of components to a production line or goods to warehouse racks, and suitable for 24/7 operation in outdoor remote monitoring systems.


VecowECX1000 400x275Vecow, which develops embedded AIoT systems, has announced a collaboration with MOV.AI, which helps assist designers with autonomous mobile robot (AMR) development. The partnership will provide an integrated AMR solution that includes Vecow’s ECX-1000 Series Workstation-grade Fanless System with MOV.AI’s Robotics Engine Platform. The combination will help customers develop industrial AMRs to meet a demand of more than 2.1 million mobile robots by the end of 2023, the companies said.


Mobileye EyeQ Ultra400x275Intel’s Mobileye division has announced the EyeQ Ultra, a system-on-chip (SoC) designed for autonomous driving applications. Unveiled during CES 2022, the EyeQ Ultra maximizes effectiveness and efficiency at only 176 TOPS, which the company said makes it the industry’s leanest autonomous vehicle (AV) chip. The first silicon for the EyeQ Ultra SoC is expected at the end of 2023, with full automotive-grade production in 2025.


VoyantPhotonics400x275Voyant Photonics, which fabricates optical systems optimized for FMCW lidar using low-cost semiconductor chips, has announced it raised $15.4 million in a Series A funding round, led by UP.Partners with participation of earlier investors LDV Capital and Contour Ventures.


CAES ESA SoC400x275CAES, which develops advanced mission-critical electronics, has announced a contract award from the European Space Agency (ESA) to develop a fault- and radiation-tolerant system-on-chip (SoC). Funded by the Swedish National Space Agency, the project aims to improve performance and power efficiency in satellite and spacecraft applications by developing a 16-core, space-hardened microprocessor based on the open RISC-V instruction set architecture (ISA).


Inforce 68A1 400x275SMART Wireless Computing, which provides edge computing embedded solutions, has announced the Inforce 68A1 system-on-module (SoM), designed to provide high performance for compute-intensive network edge IoT camera applications. Based on the Qualcomm QCS8250 system-on-chip, the Inforce 68A1 SoM combines support for multiple high-resolution 8K or 4K cameras with artificial intelligence inference at the edge to enable smart camera systems, high-performance conferencing/collaboration devices, connected healthcare, and intelligent retail devices.


Cincoze DI 1100 400x275Taiwan’s Cincoze, which develops rugged embedded computers, has announced the DI-1100 series within its DIAMOND product line. Equipped with Intel Core Whiskey Lake-U CPUs, the new computers provide high-performance and ultra-low power consumption (15W TDP). The company said the series is ideal for space-limited applications and those with limited power availability, including autonomous robots, in-vehicle usages, environmental monitoring and more.


ADLINK LEC RB5 400x275ADLINK Technology, which develops edge computing and artificial intelligence hardware and software, has announced a new high-performance module that allows on-device AI and 5G connectivity capabilities for consumer, enterprise, and industrial robots. The LEC-RB5 SMARC module is the first SMARC AI-on-module based on the Qualcomm QRB5165 processor.


Hailo Kontron400x275Kontron, which develops IoT/embedded computing technology (ECT), has announced a strategic partnership with AI chipmaker Hailo to develop next-generation AI edge inference solutions. The Hailo-8 AI processor, which performs up to 26 tera-operations per second (TOPS) at a typical power consumption of less than 2.5 watts, enables edge devices to run at performance levels previously only possible in the cloud. The new collaboration will offer customers a new level of high-performance, scalable AI-edge application-ready platforms for several market segments, including Industry 4.0, smart cities, and smart retail.


LattePanda 400x275LattePanda has launched the LattePanda 3 Delta, “the world’s thinnest pocket-sized hackable computer,” with use cases that include IoT edge, robotics, AI camera-based applications, handheld devices, and Industry 4.0. The company reached its Kickstarter goal of $39,881 within the first four hours, but other options are available at the Kickstarter page.