Microprocessors

Cincoze DI 1100 400x275Taiwan’s Cincoze, which develops rugged embedded computers, has announced the DI-1100 series within its DIAMOND product line. Equipped with Intel Core Whiskey Lake-U CPUs, the new computers provide high-performance and ultra-low power consumption (15W TDP). The company said the series is ideal for space-limited applications and those with limited power availability, including autonomous robots, in-vehicle usages, environmental monitoring and more.

 

ADLINK Technology, which develops edge computing and artificial intelligence hardware and software, has announced a new high-performance module that allows on-device AI and 5G connectivity capabilities for consumer, enterprise, and industrial robots. The LEC-RB5 SMARC module is the first SMARC AI-on-module based on the Qualcomm QRB5165 processor.

 

Hailo Kontron400x275Kontron, which develops IoT/embedded computing technology (ECT), has announced a strategic partnership with AI chipmaker Hailo to develop next-generation AI edge inference solutions. The Hailo-8 AI processor, which performs up to 26 tera-operations per second (TOPS) at a typical power consumption of less than 2.5 watts, enables edge devices to run at performance levels previously only possible in the cloud. The new collaboration will offer customers a new level of high-performance, scalable AI-edge application-ready platforms for several market segments, including Industry 4.0, smart cities, and smart retail.

 

LattePanda 400x275LattePanda has launched the LattePanda 3 Delta, “the world’s thinnest pocket-sized hackable computer,” with use cases that include IoT edge, robotics, AI camera-based applications, handheld devices, and Industry 4.0. The company reached its Kickstarter goal of $39,881 within the first four hours, but other options are available at the Kickstarter page.

 

NVIDIA JetsonAGX Orin 400x275NVIDIA has announced the new Jetson AGX Orin, a small, powerful and energy-efficient AI supercomputer aimed for robotics, autonomous machines, medical devices and other embedded computers at the edge.

 

Calterah MiniFamily400x275China’s Calterah Semiconductor has announced two new mmWave radar chip product families, the Alps-Mini and Rhine-Mini. The chips are expected to help mmWave radar to break into new applications, including autonomous driving, smart cabin, security and surveillance, as well as smart homes and cities.

 

FlexLogic400x275Flex Logix Technologies, which develops artificial intelligence edge inference accelerators and eFPGA IP, has announced the production availability of its InferX X1P1 PCIe accelerator board. Designed to bring high-performance  AI inference acceleration to edge servers and industrial vision systems, the new board provides customers with AI inference capabilities where high accuracy, high throughput and low power on complex models is needed.

 

HAILO400x275Israel’s Hailo has announced it raised $136 million in a Series C funding round, led by Poalim Equity and Gil Agmon. The latest funding brings Hailo’s total funding to $224 million, and the company plans to use the new funds to address surging interest in its Hailo-8 AI Processor for Edge Devices, as well as develop new products and expand into new and existing global markets. 

 

Microsys400x275MicroSys Electronics has announced a partnership with artificial intelligence chipmaker Hailo to launch its miriac AIP-LX2160A embedded platform, which can host up to five integrated Hailo-8 AI accelerator modules. The new edge server-grade AI solution enables high-performance and scalable AI inference capabilities at the edge. The platform offers a high bandwidth and power-efficient solution at the edge, benefiting several applications in Industry 4.0, automotive, and heavy machinery, among others.

 

VecowBlaize400x275Vecow, which develops embedded systems, and Blaize, which develops edge computing systems, have announced the launch of the Vecow ECX-2400 workstation-grade AI Computing System. The ECX-2400  uses Blaize’s Graph Streaming Processor (GSP) to deliver AI performance with higher system reliability, lower power consumption and faster time-to-market. The system is aimed for public security, robotic control, traffic vision, and any Industry 4.0 or AI applications at the edge to give a better total cost of ownership.

 

BlaizeLeiShen400x275Blaize and LeiShen have announced a strategic cooperation agreement to integrate lidar and artificial intelligence functions in applications aimed at autonomous operations in automotive and smart city markets in China. As part of the agreement, Blaize and LeiShen are building a sensor fusion solution that combines LeiShen lidar technology with AI processing on Blaize’s Pathfinder P1600 system-on-module embedded AI accelerator.

 

RubberTreeRobot400x275STMicroelectronics (STM), which develops semiconductors across the spectrum of electronics applications, has announced a design win for its STM32WLE5, a long-range (LoRa) system-on-chip (SoC). A customer application developed by rubber-tapping specialist CIHEVEA uses low-power networking to help automate the process of extracting latex from rubber trees. 

 

ADLINK COM HPC 400x275ADLINK Technology, which develops edge computing solutions, has announced the COM-HPC Ampere Altra, an 80-core COM-HPC server type module that aims to eliminate power-performance limitations. The new server type module is targeting edge platforms that can reliably and predictably process the most compute-intensive workloads, eliminating bottlenecks and restrictions typically caused by memory caches and system memory limits on edge devices.

 

DeepVision400x275Deep Vision, which develops AI processors and software for edge computing applications, has announced it raised $35 million in Series B funding, led by Tiger Global. When combined with existing revenue streams, the funding will help Deep Vision expand the capabilities of its AI processor and software tools to support its growing customer base, the company said.

 

Toshiba TXZ 400x275Toshiba Electronic Devices & Storage has started the mass production of 20 new devices in the M4G group, for high-speed data processing as new products of the TXZ+ family advanced class manufactured in a 40nm process. The products use Arm Cortex-M4 core with FPU, running up to 200 MHz, integrating a maximum of 2MB code flash and 32KB data flash memory with 100K write cycle endurance, and featuring various interfaces and communication options. The M4G group devices are aimed at office equipment, building, and factory automation applications.

 

RenesasEK RA6M5 400x275Renesas Electronics Corp., which supplies advanced semiconductor solutions, and eProsima, which develops middleware solutions, have announced the Renesas EK-RA6M5 Evaluation Kit for RA microcontroller units (MCUs), a platform of the micro-ROS development framework. Renesas said it teamed with eProsima, the main developer of the micro-ROS framework, to port micro-ROS into the RA MCUs, to ease development of professional robotics applications for IoT and industrial systems.